Invention Grant
- Patent Title: Antenna-embedded electronic device case
- Patent Title (中): 天线嵌入式电子设备案例
-
Application No.: US13157328Application Date: 2011-06-10
-
Publication No.: US08686904B2Publication Date: 2014-04-01
- Inventor: Yu-Ju Chen , Shih-Wei Li , Der-Chung Hwang , Chen-Ta Hung
- Applicant: Yu-Ju Chen , Shih-Wei Li , Der-Chung Hwang , Chen-Ta Hung
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: CKC & Partners Co., Ltd.
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
An antenna-embedded electronic device case includes an electrically-insulated case wall, a lower and an upper ground conductive layers, a lower and an upper electrically-insulated layer, and a continuous conductive layer. The lower ground conductive layer is in contact with the electrically-insulated case wall. The lower and upper electrically-insulated layers are sandwiched between the lower and upper ground conductive layers. The continuous conductive layer has a first portion sandwiched between the lower and upper electrically-insulated layers and a second portion protruding out to serve as an antenna radiator for transmitting or receiving electromagnetic signals.
Public/Granted literature
- US20110304514A1 ANTENNA-EMBEDDED ELECTRONIC DEVICE CASE Public/Granted day:2011-12-15
Information query