Invention Grant
- Patent Title: Substrate mounting table of substrate processing apparatus
- Patent Title (中): 基板加工装置基板安装台
-
Application No.: US12947214Application Date: 2010-11-16
-
Publication No.: US08687343B2Publication Date: 2014-04-01
- Inventor: Tetsuji Sato , Takashi Kitazawa , Akihiro Yoshimura
- Applicant: Tetsuji Sato , Takashi Kitazawa , Akihiro Yoshimura
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2009-261867 20091117
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C23F1/00
Abstract:
A substrate mounting table of a substrate processing apparatus includes a base portion and a circular plate-shaped electrostatic chuck adhered to an upper surface of the base portion by an adhesive layer. The electrostatic chuck has a circular attracting surface to support a substrate. The substrate mounting table further includes an annular focus ring arranged around the electrostatic chuck to surround the substrate and to cover an outer peripheral portion of the upper surface of the base portion. The electrostatic chuck has a two-layer structure including an upper circular part and a lower circular part having a diameter larger than that of the upper circular part. An outer peripheral portion of the lower circular part and an outer peripheral portion of the adhesive layer adhering the lower circular part to the base portion are covered with the focus ring.
Public/Granted literature
- US20110116207A1 SUBSTRATE MOUNTING TABLE OF SUBSTRATE PROCESSING APPARATUS Public/Granted day:2011-05-19
Information query
IPC分类:
