Invention Grant
- Patent Title: Enclosure with duct mounted electronic components
- Patent Title (中): 外壳与管道安装的电子元件
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Application No.: US13460967Application Date: 2012-05-01
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Publication No.: US08687363B2Publication Date: 2014-04-01
- Inventor: Christopher Todd Moore
- Applicant: Christopher Todd Moore
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Sutherland Asbill & Brennan LLP
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
The present application provides for an enclosure for mounting electrical components therein. The enclosure may include a base, a roof, a number of side walls, and one or more support ducts extending from the base to the roof. The supports ducts may include an air channel therein extending from the base to the roof.
Public/Granted literature
- US20130292095A1 Enclosure with Duct Mounted Electronic Components Public/Granted day:2013-11-07
Information query
