Invention Grant
- Patent Title: Semiconductor device and information processing system including the same
- Patent Title (中): 半导体装置和信息处理系统也包括在内
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Application No.: US12929669Application Date: 2011-02-07
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Publication No.: US08687449B2Publication Date: 2014-04-01
- Inventor: Hideyuki Yoko
- Applicant: Hideyuki Yoko
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2011-016003 20110128
- Main IPC: G11C7/00
- IPC: G11C7/00

Abstract:
A semiconductor device according to the present invention includes plural core chips CC0 to CC7 to which mutually different pieces of chip identification information LID are allocated, and an interface chip IF that controls the core chips CC0 to CC7. The interface chip IF receives address information ADD for specifying a memory cell, and supplies in common a part of the address information to the core chips CC0 to CC7 as chip selection information SEL to be compared with the chip identification information LID. With this configuration, it appears from a controller that an address space is simply enlarged. Therefore, an interface that is same as that for a conventional semiconductor memory device can be used.
Public/Granted literature
- US20120195148A1 Semiconductor device and information processing system including the same Public/Granted day:2012-08-02
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