Invention Grant
US08688176B2 Components with mechanically-bonded plastic and methods for forming such components
有权
具有机械粘合塑料的部件和形成这些部件的方法
- Patent Title: Components with mechanically-bonded plastic and methods for forming such components
- Patent Title (中): 具有机械粘合塑料的部件和形成这些部件的方法
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Application No.: US13370526Application Date: 2012-02-10
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Publication No.: US08688176B2Publication Date: 2014-04-01
- Inventor: Jason Donald Mareno
- Applicant: Jason Donald Mareno
- Applicant Address: TW Taoyuan
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H04B1/38
- IPC: H04B1/38

Abstract:
Components and methods for forming such components with mechanically-bonded plastic are provided. A representative method includes: providing a metal chassis, the chassis having an opening extending through; placing the chassis in a mold; flowing plastic into the mold such that the plastic flows into the opening, the plastic being mechanically bonded to the metal of the chassis to form an integrated metal and plastic component; and removing the integrated metal and plastic component from the mold.
Public/Granted literature
- US20130210504A1 COMPONENTS WITH MECHANICALLY-BONDED PLASTIC AND METHODS FOR FORMING SUCH COMPONENTS Public/Granted day:2013-08-15
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