Invention Grant
- Patent Title: Firmware component modification
- Patent Title (中): 固件组件修改
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Application No.: US11514010Application Date: 2006-08-31
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Publication No.: US08688933B2Publication Date: 2014-04-01
- Inventor: Darren J. Cepulis
- Applicant: Darren J. Cepulis
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G06F9/44
Abstract:
Systems, methods, and other embodiments associated with firmware modification are described. One system embodiment includes modification utility configured to modify a less-than whole portion of the archive based on a modification request. The system embodiment may also include a nonvolatile memory containing an archive of one or more firmware components.
Public/Granted literature
- US20080059730A1 Firmware component modification Public/Granted day:2008-03-06
Information query
