Invention Grant
US08689435B2 Mounting system for mounting electronic components 有权
用于安装电子元件的安装系统

  • Patent Title: Mounting system for mounting electronic components
  • Patent Title (中): 用于安装电子元件的安装系统
  • Application No.: US13434452
    Application Date: 2012-03-29
  • Publication No.: US08689435B2
    Publication Date: 2014-04-08
  • Inventor: Shinya Nishida
  • Applicant: Shinya Nishida
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: K&L Gates LLP
  • Priority: JP2011-098335 20110426
  • Main IPC: B23P19/00
  • IPC: B23P19/00
Mounting system for mounting electronic components
Abstract:
A mounting system including: a storage that stores plural formats for each substrate including divisional information of a mounting apparatus indicating which of plural mounting apparatuses that divisionally mount plural electronic components on a substrate mounts what electronic component on the substrate and information on a deviation amount of an electronic component indicating how much each of the electronic components mounted on the substrate and inspected by an inspection apparatus is deviated from its regular position; and a controller that changes, according to a change of an assignment of mounting, the divisional information in a format corresponding to the substrate for which the assignment has been changed, and controls the mounting apparatus that has mounted the electronic component and has been specified from the mounting apparatuses to mount the electronic component on the substrate after correcting a deviation amount based on the information on a deviation amount.
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