Invention Grant
- Patent Title: Wire and methodology for cutting materials with wire
- Patent Title (中): 用电线切割材料的线和方法
-
Application No.: US12938241Application Date: 2010-11-02
-
Publication No.: US08689777B2Publication Date: 2014-04-08
- Inventor: Daniel James Branagan , Brian E. Meacham , Jason K. Walleser , Jikou Zhou , Alla V. Sergueeva , David Paratore
- Applicant: Daniel James Branagan , Brian E. Meacham , Jason K. Walleser , Jikou Zhou , Alla V. Sergueeva , David Paratore
- Applicant Address: US RI Providence
- Assignee: The NanoSteel Company, Inc.
- Current Assignee: The NanoSteel Company, Inc.
- Current Assignee Address: US RI Providence
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Main IPC: B28D1/08
- IPC: B28D1/08 ; B24B1/00

Abstract:
Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7 to 50 at %, at least one non-metal or metalloid selected from the group consisting of boron, carbon, silicon, phosphorus, and/or nitrogen present in the range of about 1 to 35 at %, and one metal selected from the group consisting of copper, titanium, molybdenum, aluminum, and/or chromium present in the range of about 0 to 25 at %, wherein the wire has an aspect ratio of greater than one and exhibits metallic and/or crystalline phases of less than 500 nm in size.
Public/Granted literature
- US20110100347A1 Wire and Methodology for Cutting Materials With Wire Public/Granted day:2011-05-05
Information query