Invention Grant
- Patent Title: Envelope assembly
- Patent Title (中): 信封装配
-
Application No.: US13301420Application Date: 2011-11-21
-
Publication No.: US08690042B2Publication Date: 2014-04-08
- Inventor: Amanda Wawrzyniak , Todd Davis
- Applicant: Amanda Wawrzyniak , Todd Davis
- Applicant Address: US IL Elgin
- Assignee: Continental Datalabel, Inc.
- Current Assignee: Continental Datalabel, Inc.
- Current Assignee Address: US IL Elgin
- Agency: Pauley Petersen & Erickson
- Main IPC: B65D27/04
- IPC: B65D27/04

Abstract:
An assembly including a front panel is separated from a back panel by a panel fold line. Side flaps are disposed at opposing edges of the front panel and are each separated from the front panel by a flap fold line. The side flaps include a front flap surface with an adhesive material and a back flap surface opposite the front flap surface. The assembly is foldable about the panel fold line to dispose the back panel adjacent the front panel and foldable about the flap fold line to dispose the back flap surface adjacent a front surface of the back panel when the back panel is folded. In a folded position, the assembly forms a pocket between the front and back panels, and is adherable by the adhesive material to a separate surface.
Public/Granted literature
- US20120132698A1 ENVELOPE ASSEMBLY Public/Granted day:2012-05-31
Information query