Invention Grant
- Patent Title: Fluid nozzle array
- Patent Title (中): 流体喷嘴阵列
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Application No.: US13821204Application Date: 2010-09-15
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Publication No.: US08690295B2Publication Date: 2014-04-08
- Inventor: Sadiq Bengali , Chien-Hua Chen , Galen P. Cook , Michael W. Cumbie , Robert K. Messenger
- Applicant: Sadiq Bengali , Chien-Hua Chen , Galen P. Cook , Michael W. Cumbie , Robert K. Messenger
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2010/048976 WO 20100915
- International Announcement: WO2012/036682 WO 20120322
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A method for fabricating a fluid nozzle array includes forming a circuitry layer onto a substrate, the substrate comprising a stopping layer disposed between a membrane layer and a handle layer, forming a fluid feedhole extending from a surface of the membrane layer to the stopping layer, and forming a fluid supply trench extending from a surface of the handle layer to the stopping layer. A fluid nozzle array includes a substrate including a membrane layer, a stopping layer adjacent to the membrane layer, a handle layer adjacent to the stopping layer, and a set of fluid chambers disposed on a surface of the membrane layer above and along a width of a fluid supply trench extending from a surface of the handle layer to the stopping layer.
Public/Granted literature
- US20130162717A1 FLUID NOZZLE ARRAY Public/Granted day:2013-06-27
Information query
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