Invention Grant
- Patent Title: Integral heat sink and housing light emitting diode assembly
- Patent Title (中): 集成散热器和外壳发光二极管组件
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Application No.: US12996560Application Date: 2009-06-04
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Publication No.: US08690384B2Publication Date: 2014-04-08
- Inventor: Peter A. Hochstein
- Applicant: Peter A. Hochstein
- Applicant Address: US MI Oxford
- Assignee: Relume Technologies, Inc.
- Current Assignee: Relume Technologies, Inc.
- Current Assignee Address: US MI Oxford
- Agency: Dickinson Wright, PLLC
- International Application: PCT/US2009/046218 WO 20090604
- International Announcement: WO2009/149238 WO 20091210
- Main IPC: F21V19/02
- IPC: F21V19/02

Abstract:
A light assembly (20) for mounting to a planar support includes an extruded heat sink (22) presenting a mounting surface (24) and a heat transfer surface (26) slanted from an upper border (32) to a lower border (30). A panel block (52) depends from the lower border (30), a lens block (68) depends from the upper border (32), a back side (76) extends downwardly from the lens block (60), a truss member (82) interconnects the back side (76) and the heat transfer surface (26), and a mounting block (84) extends from the back side (76). The extruded heat sink (22) is cut into independent elongated sections (28) and light emitting diodes (44) are disposed thereon. The elongated sections (28) are mitered to one another to define a frame. A light directing panel (56) extends from the panel blocks (52) and a lens sheet (72) extends from the lens blocks (68).
Public/Granted literature
- US20110122616A1 INTEGRAL HEAT SINK AND HOUSING LIGHT EMITTING DIODE ASSEMBLY Public/Granted day:2011-05-26
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