Invention Grant
- Patent Title: Method for manufacturing ejection element substrate
- Patent Title (中): 喷射元件基板的制造方法
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Application No.: US13281714Application Date: 2011-10-26
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Publication No.: US08691101B2Publication Date: 2014-04-08
- Inventor: Souta Takeuchi , Hirokazu Komuro , Sadayoshi Sakuma
- Applicant: Souta Takeuchi , Hirokazu Komuro , Sadayoshi Sakuma
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2010-248886 20101105
- Main IPC: G01D15/18
- IPC: G01D15/18

Abstract:
A method for manufacturing an ejection element substrate, which is provided with a flow-channel-forming member having an ejection orifice for ejecting a liquid and a liquid flow channel that is communicated with the ejection orifice, a substrate having a supply port for supplying the liquid to the liquid flow channel, and a filter structure formed in the bottom of the supply port, includes: forming the supply port by forming a through-hole by etching the substrate from a second face of the substrate on the side opposite to a first face of the substrate, on which the flow-channel-forming member is disposed; providing a resinous protection film on the side face and the bottom of the supply port; and forming a minute opening in the resinous protection film in the bottom of the supply port by carrying out a laser processing from the side of the second face.
Public/Granted literature
- US20120111828A1 METHOD FOR MANUFACTURING EJECTION ELEMENT SUBSTRATE Public/Granted day:2012-05-10
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