Invention Grant
US08691118B2 Conductive metal ink composition and method for forming a conductive pattern
有权
导电金属油墨组合物和形成导电图案的方法
- Patent Title: Conductive metal ink composition and method for forming a conductive pattern
- Patent Title (中): 导电金属油墨组合物和形成导电图案的方法
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Application No.: US13392260Application Date: 2010-08-24
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Publication No.: US08691118B2Publication Date: 2014-04-08
- Inventor: Jie-Hyun Seong , Soo-Yeon Heo , Jong-Taik Lee , Kyoung-Su Jeon
- Applicant: Jie-Hyun Seong , Soo-Yeon Heo , Jong-Taik Lee , Kyoung-Su Jeon
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge LLP
- Priority: KR10-2009-0079361 20090826; KR10-2010-0081974 20100824
- International Application: PCT/KR2010/005651 WO 20100824
- International Announcement: WO2011/025228 WO 20110303
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01B1/12 ; H01B1/22

Abstract:
The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same.The conductive metal ink composition comprises a conductive metal powder; an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer.
Public/Granted literature
- US20120225198A1 CONDUCTIVE METAL INK COMPOSITION AND METHOD FOR FORMING A CONDUCTIVE PATTERN Public/Granted day:2012-09-06
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