Invention Grant
- Patent Title: Fine processing method, fine processing apparatus, and recording medium with fine processing program recorded thereon
- Patent Title (中): 精加工方法,精细加工装置以及记录有精加工程序的记录介质
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Application No.: US13204844Application Date: 2011-08-08
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Publication No.: US08691123B2Publication Date: 2014-04-08
- Inventor: Yasutada Nakagawa , Takuya Kono , Ikuo Yoneda , Masayuki Hatano
- Applicant: Yasutada Nakagawa , Takuya Kono , Ikuo Yoneda , Masayuki Hatano
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-214422 20100924
- Main IPC: B29C43/58
- IPC: B29C43/58

Abstract:
According to one embodiment, a fine processing method includes determining a resist amount required for each first region of a pattern formation surface and a total amount of resist. The method include dividing the total amount of resist by a volume of one resist drop to determine the resist drops total number. The method include determining a provisional position for the resist drop of the total number. The method include assigning the each first region to nearest one resist drop, and partitioning again the pattern formation surface into second regions assigned to the each resist drop. The method include determining a divided value by dividing the volume of the one resist drop by the required total amount of resist determined. The method include finalizing a final position of the each resist drop, if a distribution of the divided value in the pattern formation surface falls within a target range.
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