Invention Grant
- Patent Title: Adhesive patch
- Patent Title (中): 胶贴
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Application No.: US10525646Application Date: 2003-08-07
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Publication No.: US08691267B2Publication Date: 2014-04-08
- Inventor: Takaaki Terahara , Kazunosuke Aida , Arata Toshimitsu , Naruhito Higo
- Applicant: Takaaki Terahara , Kazunosuke Aida , Arata Toshimitsu , Naruhito Higo
- Applicant Address: JP Tosu-Shi, Saga
- Assignee: Hisamitsu Pharmaceutical Co., Inc.
- Current Assignee: Hisamitsu Pharmaceutical Co., Inc.
- Current Assignee Address: JP Tosu-Shi, Saga
- Agency: Nath, Goldberg & Meyer
- Agent Shedlon M. McGee; Tanya E. Harkins
- Priority: JP2002-249440 20020828
- International Application: PCT/JP03/10092 WO 20030807
- International Announcement: WO2004/019988 WO 20040311
- Main IPC: A61K9/70
- IPC: A61K9/70 ; A61F13/02
Abstract:
A patch comprising a backing layer and an adhesive layer disposed on the backing layer and compounded with a drug and an adhesive base agent, wherein the adhesive base agent comprises styrene-isoprene-styrene block copolymer, 2-ethylhexyl acrylate-vinyl acetate copolymer and a basic nitrogen-including polymer including a basic nitrogen and having no adhesion property at normal temperature.
Public/Granted literature
- US20050260255A1 Adhesive patch Public/Granted day:2005-11-24
Information query
