Invention Grant
- Patent Title: Cutting tool
- Patent Title (中): 切割用具
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Application No.: US13700408Application Date: 2011-05-27
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Publication No.: US08691366B2Publication Date: 2014-04-08
- Inventor: Masahiro Waki , Yaocan Zhu
- Applicant: Masahiro Waki , Yaocan Zhu
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Schlee IP International, P.C.
- Agent Alexander R. Schlee
- Priority: JP2010-121715 20100527
- International Application: PCT/JP2011/062242 WO 20110527
- International Announcement: WO2011/149064 WO 20111201
- Main IPC: B23B27/14
- IPC: B23B27/14

Abstract:
A cutting tool with a substrate which is coated with a coating layer containing TiaAlbNbdMe(C1-xNx), where M represents one or more elements selected from among Si, W, Mo, Ta, Hf, Cr, Zr and Y, where 0.1≦a≦0.7, 0≦b≦0.8, 0.02≦d≦0.25, 0≦e≦25, a+b+d+e=1.0 and 0≦x≦1 and is provided with a rake face; a flank face; a cutting edge between the rake face and the flank face; and droplets on the surface of the coating layer. The droplets include finer droplets having particle diameters of 300 nm or less; and coarser droplets having particle diameters of 1000 nm or more. The flank face has a higher percentage of the finer droplets than the rake face. An Nb content in the coarser droplets on the flank face is higher than an Nb of the coarser droplets on the rake face.
Public/Granted literature
- US20130071620A1 CUTTING TOOL Public/Granted day:2013-03-21
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