Invention Grant
- Patent Title: Thermally conductive sheet and method of manufacturing the same
- Patent Title (中): 导热片及其制造方法
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Application No.: US12079399Application Date: 2008-03-26
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Publication No.: US08691368B2Publication Date: 2014-04-08
- Inventor: Mitsuru Ohta , Motoki Ozawa , Yoshiaki Okabayashi
- Applicant: Mitsuru Ohta , Motoki Ozawa , Yoshiaki Okabayashi
- Applicant Address: JP Tokyo
- Assignee: Polymatech Co., Ltd.
- Current Assignee: Polymatech Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Seager, Tufte & Wickhem LLC
- Priority: JP2007-089859 20070329
- Main IPC: B32B3/10
- IPC: B32B3/10

Abstract:
A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.
Public/Granted literature
- US20080241488A1 Thermally conductive sheet and method of manufacturing the same Public/Granted day:2008-10-02
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