Invention Grant
- Patent Title: Material for packaging electronic components
- Patent Title (中): 电子元器件包装材料
-
Application No.: US13260942Application Date: 2010-04-01
-
Publication No.: US08691375B2Publication Date: 2014-04-08
- Inventor: Anton Kuepper , Christian Weinmann
- Applicant: Anton Kuepper , Christian Weinmann
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Roberts S. Moshrefzadeh
- Priority: EP09157250 20090403
- International Application: PCT/US2010/029534 WO 20100401
- International Announcement: WO2010/114944 WO 20101007
- Main IPC: B32B3/26
- IPC: B32B3/26

Abstract:
The invention provides a material for packaging of electronic components comprising a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non conductive interior, said cells being interconnected so that any two adjacent cells share at least a portion of their respective rims.
Public/Granted literature
- US20120028026A1 MATERIAL FOR PACKAGING ELECTRONIC COMPONENTS Public/Granted day:2012-02-02
Information query