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US08691375B2 Material for packaging electronic components 失效
电子元器件包装材料

Material for packaging electronic components
Abstract:
The invention provides a material for packaging of electronic components comprising a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non conductive interior, said cells being interconnected so that any two adjacent cells share at least a portion of their respective rims.
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