Invention Grant
- Patent Title: Bonded body of a carbon thin film covered article and a rubber
- Patent Title (中): 粘结体的碳薄膜覆盖物和橡胶
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Application No.: US13579255Application Date: 2010-12-09
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Publication No.: US08691386B2Publication Date: 2014-04-08
- Inventor: Kazuto Yamakawa , Yuusuke Matsuya
- Applicant: Kazuto Yamakawa , Yuusuke Matsuya
- Applicant Address: JP
- Assignee: The Yokohama Rubber Co., Ltd.
- Current Assignee: The Yokohama Rubber Co., Ltd.
- Current Assignee Address: JP
- Agency: Thorpe North & Western LLP
- Priority: JP2010-030130 20100215
- International Application: PCT/JP2010/072174 WO 20101209
- International Announcement: WO2011/099220 WO 20110818
- Main IPC: B23B9/00
- IPC: B23B9/00 ; B23B7/04 ; C01B31/00 ; B23B37/00 ; E01D1/00
Abstract:
A bonded body 10 of a carbon film covered article and a rubber is formed by bonding a carbon film covered article 13 having a carbon film 12 formed on a surface of an article 11 to an unvulcanized rubber 14 by affixing and vulcanizing. Thereby, a bonded body of rubber and, for example, metal can be provided without the need for an adhesive.
Public/Granted literature
- US20120315472A1 BONDED BODY OF A CARBON THIN FILM COVERED ARTICLE AND A RUBBER Public/Granted day:2012-12-13
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