Invention Grant
- Patent Title: EMI shielding heat shrinkable tapes
- Patent Title (中): EMI屏蔽热收缩胶带
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Application No.: US13747086Application Date: 2013-01-22
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Publication No.: US08691393B2Publication Date: 2014-04-08
- Inventor: Kelly G. Cook , Larry D. Creasy, Jr.
- Applicant: Kelly G. Cook , Larry D. Creasy, Jr.
- Applicant Address: US MO Earth City
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: US MO Earth City
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H01R13/658
- IPC: H01R13/658 ; B32B15/08 ; B32B15/082 ; B32B15/085 ; B32B15/09 ; B32B15/095 ; B32B15/14 ; B32B27/08 ; B32B27/12 ; B32B27/30 ; B32B27/32 ; B32B27/36
Abstract:
Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.
Public/Granted literature
- US20130133941A1 EMI SHIELDING HEAT SHRINKABLE TAPES Public/Granted day:2013-05-30
Information query
