Invention Grant
- Patent Title: Battery pack and wiring substrate
- Patent Title (中): 电池组和接线基板
-
Application No.: US12057433Application Date: 2008-03-28
-
Publication No.: US08691411B2Publication Date: 2014-04-08
- Inventor: Tsukasa Takahashi , Tomomichi Okada , Shoji Tatehata
- Applicant: Tsukasa Takahashi , Tomomichi Okada , Shoji Tatehata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-011959 20080122
- Main IPC: H01M10/48
- IPC: H01M10/48 ; H01M2/02 ; H01M6/46

Abstract:
A battery pack includes a pack body that includes a battery cell and that has an external shape substantially symmetric with respect to the horizontal and vertical axes, viewed from a front face on which terminals are arranged, and a terminal unit on the front face. The terminal unit includes a positive terminal, a negative terminal, a control terminal, and a temperature detection terminal for outputting temperature data. The positive terminal and the negative terminal are arranged on one side with respect to a center line in the width direction of the pack body. The control terminal is arranged symmetrically to the temperature detection terminal with respect to the center line in the width direction of the pack body.
Public/Granted literature
- US20090186262A1 BATTERY PACK AND WIRING SUBSTRATE Public/Granted day:2009-07-23
Information query