Invention Grant
- Patent Title: Fabrication method of semiconductor device
- Patent Title (中): 半导体器件的制造方法
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Application No.: US13557674Application Date: 2012-07-25
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Publication No.: US08691635B2Publication Date: 2014-04-08
- Inventor: Seiji Momota , Takeshi Fujii , Satoshi Kamijima , Makoto Asai
- Applicant: Seiji Momota , Takeshi Fujii , Satoshi Kamijima , Makoto Asai
- Applicant Address: JP Kawasaki-shi JP Kariya
- Assignee: Fuji Electric Co., Ltd.,Denso Corporation
- Current Assignee: Fuji Electric Co., Ltd.,Denso Corporation
- Current Assignee Address: JP Kawasaki-shi JP Kariya
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-037535 20100223
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/66 ; H01L29/739 ; H01L29/78

Abstract:
A semiconductor device includes a first semiconductor region of a first conductivity type; a second semiconductor region of a second conductivity type, disposed on a surface of the first semiconductor region, and having an impurity concentration higher than that of the first semiconductor region; a trench that penetrates the second semiconductor region to reach the first semiconductor region; a first electrode disposed inside the trench via an insulating film; a first recess portion disposed deeper than an upper end of the first electrode, in a surface layer of the second semiconductor region, so as to be in contact with the trench; and a second electrode embedded in the first recess portion.
Public/Granted literature
- US20120289012A1 FABRICATION METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2012-11-15
Information query
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