Invention Grant
- Patent Title: Method of fabricating semiconductor device including forming epitaxial blocking layers by nitridation process
- Patent Title (中): 制造半导体器件的方法包括通过氮化处理形成外延阻挡层
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Application No.: US13238611Application Date: 2011-09-21
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Publication No.: US08691642B2Publication Date: 2014-04-08
- Inventor: Jung-Chan Lee , Seung-Jae Lee , Yu-Gyun Shin , Dae-Young Kwak , Byung-Suk Jung
- Applicant: Jung-Chan Lee , Seung-Jae Lee , Yu-Gyun Shin , Dae-Young Kwak , Byung-Suk Jung
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2010-0094317 20100929
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
A method of fabricating a semiconductor device includes forming gate structures on PMOS and NMOS transistor regions of the semiconductor substrate, forming epitaxial blocking layers on source/drain regions of PMOS and NMOS transistor regions using a nitridation process, then selectively removing one of the epitaxial blocking layers, and using a SEG process to form an epitaxial layer on respective source/drain regions while shielding the other source/drain regions with a remaining epitaxial blocking layer.
Public/Granted literature
- US20120077319A1 METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING EPITAXIAL BLOCKING LAYERS Public/Granted day:2012-03-29
Information query
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