Invention Grant
US08691685B2 Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
有权
预防和控制在无铅Ni（P）金属化的集成电路接触结构中的无铅，富含Sn的焊料在微电子封装的接触中形成的金属间合金夹杂物
- Patent Title: Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
- Patent Title (中): 预防和控制在无铅Ni（P）金属化的集成电路接触结构中的无铅，富含Sn的焊料在微电子封装的接触中形成的金属间合金夹杂物
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Application No.: US11657000Application Date: 2007-01-23
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Publication No.: US08691685B2Publication Date: 2014-04-08
- Inventor: Sung Kwon Kang , Da-Yuan Shih , Yoon-Chul Son
- Applicant: Sung Kwon Kang , Da-Yuan Shih , Yoon-Chul Son
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: The Law Offices of Robert J. Eichelburg
- Agent Robert J. Eichelburg
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions can be achieved through a reaction-preventative or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P).
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