Invention Grant
- Patent Title: Heat curable adhesive composition
- Patent Title (中): 热固性粘合剂组合物
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Application No.: US12973044Application Date: 2010-12-20
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Publication No.: US08691909B2Publication Date: 2014-04-08
- Inventor: Olivier LaFerte , David Goubard
- Applicant: Olivier LaFerte , David Goubard
- Applicant Address: FR Courbevoie
- Assignee: Bostik S.A.
- Current Assignee: Bostik S.A.
- Current Assignee Address: FR Courbevoie
- Agency: Millen, White, Zelano & Branigan, P.C.
- Priority: FR0906194 20091221
- Main IPC: C08L83/00
- IPC: C08L83/00 ; C08L57/02

Abstract:
1) Heat-curable adhesive composition comprising: from 20 to 85% of a polyether (A) comprising 2 hydrolysable alkoxysilane-type end groups, having a viscosity, measured at 23° C., ranging from 25 to 40 Pa·s and of formula (I): in which: R1 and R2 represent an alkyl radical having 1 to 4 carbon atoms; R3 represents a linear alkylene radical having 1 to 6 carbon atoms; R4 represents an alkylene radical having 1 to 4 carbon atoms; n is an integer such that the number-average molecular weight Mn of the polymer of formula (I) is between 20 kDa and 40 kDa; p is an integer equal to 0, 1 or 2; from 15 to 80% of a compatible tackifying resin (B); and from 0.01 to 3% of a curing catalyst (C). 2) Self-adhesive support coated with the cured adhesive composition.3) Use for the manufacture of self-adhesive labels and/or tapes.
Public/Granted literature
- US20110151253A1 HEAT CURABLE ADHESIVE COMPOSITION Public/Granted day:2011-06-23
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