Invention Grant
- Patent Title: Multilayer substrate
- Patent Title (中): 多层基板
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Application No.: US13369363Application Date: 2012-02-09
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Publication No.: US08692125B2Publication Date: 2014-04-08
- Inventor: Noboru Kato , Jun Sasaki , Satoshi Ishino
- Applicant: Noboru Kato , Jun Sasaki , Satoshi Ishino
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-186282 20090811
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
Public/Granted literature
- US20120138340A1 MULTILAYER SUBSTRATE Public/Granted day:2012-06-07
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