Invention Grant
- Patent Title: Wired circuit board and producing method thereof
- Patent Title (中): 有线电路板及其制造方法
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Application No.: US12805710Application Date: 2010-08-16
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Publication No.: US08692126B2Publication Date: 2014-04-08
- Inventor: Jun Ishii , Hirotoshi Iguchi
- Applicant: Jun Ishii , Hirotoshi Iguchi
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Niels PLLC
- Agent Jean C. Edwards
- Priority: JP2009-195840 20090826
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer, and a conductive layer formed on the insulating layer. In the metal supporting layer, a reference hole for positioning is formed, and a stepped portion is formed so as to surround the reference hole.
Public/Granted literature
- US20110048785A1 Wired circuit board and producing method thereof Public/Granted day:2011-03-03
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