Invention Grant
US08692131B2 Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits
有权
可热成型聚合物厚膜银导体及其在电容开关电路中的应用
- Patent Title: Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits
- Patent Title (中): 可热成型聚合物厚膜银导体及其在电容开关电路中的应用
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Application No.: US14050525Application Date: 2013-10-10
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Publication No.: US08692131B2Publication Date: 2014-04-08
- Inventor: Jay Robert Dorfman , Vincenzo Arancio
- Applicant: E I du Pont de Nemours and Company
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: G06F3/044
- IPC: G06F3/044 ; H03K17/975 ; H01B1/22
Abstract:
This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
Public/Granted literature
- US20140037941A1 THERMOFORMABLE POLYMER THICK FILM SILVER CONDUCTOR AND ITS USE IN CAPACITIVE SWITCH CIRCUITS Public/Granted day:2014-02-06
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