Invention Grant
- Patent Title: Wiring board capable of containing functional element and method for manufacturing same
- Patent Title (中): 能够包含功能元件的接线板及其制造方法
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Application No.: US13060990Application Date: 2009-08-25
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Publication No.: US08692135B2Publication Date: 2014-04-08
- Inventor: Takuo Funaya , Shintaro Yamamichi , Daisuke Ohshima , Yoshiki Nakashima
- Applicant: Takuo Funaya , Shintaro Yamamichi , Daisuke Ohshima , Yoshiki Nakashima
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-218558 20080827
- International Application: PCT/JP2009/064757 WO 20090825
- International Announcement: WO2010/024233 WO 20100304
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18
Abstract:
A wiring board is configured by stacking one or more conductor wiring layers and one or more insulating resin layers and comprising one or more metal vias configured to penetrate the insulating resin layer, wherein the boundary surface between the metal via and the insulating resin layer has a concavo-convex boundary cross-section structure in which the metal via and the insulating resin layer are engaged with each other.
Public/Granted literature
- US20110155433A1 WIRING BOARD CAPABLE OF CONTAINING FUNCTIONAL ELEMENT AND METHOD FOR MANUFACTURING SAME Public/Granted day:2011-06-30
Information query
