Invention Grant
US08692155B2 Method of material processing with laser pulses having a large spectral bandwidth and apparatus for carrying out said method
有权
具有大光谱带宽的激光脉冲的材料处理方法和用于执行所述方法的装置
- Patent Title: Method of material processing with laser pulses having a large spectral bandwidth and apparatus for carrying out said method
- Patent Title (中): 具有大光谱带宽的激光脉冲的材料处理方法和用于执行所述方法的装置
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Application No.: US13195501Application Date: 2011-08-01
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Publication No.: US08692155B2Publication Date: 2014-04-08
- Inventor: Mark Bischoff , Martin Hacker , Roland Sauerbrey , Gregor Stobrawa , Wolfgang Ziegler
- Applicant: Mark Bischoff , Martin Hacker , Roland Sauerbrey , Gregor Stobrawa , Wolfgang Ziegler
- Applicant Address: DE Jena
- Assignee: Carl Zeiss Meditec AG
- Current Assignee: Carl Zeiss Meditec AG
- Current Assignee Address: DE Jena
- Agency: Patterson Thuente Pedersen, P.A.
- Priority: DE10333770 20030723
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/06

Abstract:
A method and device for processing materials with laser pulses having a large spectral bandwidth and a device for carrying out said method. The aim of the invention is to create an easy, flexible method enabling universally applicable processing which can, however, be adapted to specific processing and methodological requirements. According to the invention, one or several spectral parameters of the laser pulses, i.e. the spectral amplitude and/or spectral phase and/or spectral polarization thereof, is/are specifically modified, preferably according to a measuring process variable, in order to process material or during the occurrence of said processing. The invention is used in order to process material with laser pulses having a large spectral bandwidth, particularly femto-second pulses and pico-second pulses.
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