Invention Grant
- Patent Title: Semiconductor light emitting device and wafer
- Patent Title (中): 半导体发光器件和晶圆
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Application No.: US13671578Application Date: 2012-11-08
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Publication No.: US08692228B2Publication Date: 2014-04-08
- Inventor: Kei Kaneko , Yasuo Ohba , Hiroshi Katsuno , Mitsuhiro Kushibe
- Applicant: Kei Kaneko , Yasuo Ohba , Hiroshi Katsuno , Mitsuhiro Kushibe
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2008-231097 20080909
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
A semiconductor light emitting device includes a first layer including at least one of n-type GaN and n-type AlGaN; a second layer including Mg-containing p-type AlGaN; and a light emitting section provided between the first and second layers. The light emitting section includes barrier layers of Si-containing AlxGa1-x-yInyN (0≦x, 0≦y, x+y≦1), and a well layer provided between the barrier layers and made of GaInN or AlGaInN. The barrier layers have a nearest barrier layer nearest to the second layer among the barrier layers and a far barrier layer. The nearest barrier layer includes a first portion made of Si-containing AlxGa1-x-yInyN (0≦x, 0≦y, x+y≦1), and a second portion provided between the first portion and the second layer and made of AlxGa1-x-yInyN (0≦x, 0≦y, x+y≦1). The Si concentration in the second portion is lower than those in the first portion and in the far barrier layer.
Public/Granted literature
- US20130112988A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND WAFER Public/Granted day:2013-05-09
Information query
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