Invention Grant
US08692299B2 Two-step shallow trench isolation (STI) process 有权
两步浅沟槽隔离(STI)工艺

Two-step shallow trench isolation (STI) process
Abstract:
An integrated circuit device and a process for making the integrated circuit device. The integrated circuit device including a substrate having a trench formed therein, a first layer of isolation material occupying the trench, a second layer of isolation material formed over the first layer of isolation material, an epitaxially-grown silicon layer on the substrate and horizontally adjacent the second layer of isolation material, and a gate structure formed on the epitaxially-grown silicon, the gate structure defining a channel.
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