Invention Grant
- Patent Title: Two-step shallow trench isolation (STI) process
- Patent Title (中): 两步浅沟槽隔离(STI)工艺
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Application No.: US13594254Application Date: 2012-08-24
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Publication No.: US08692299B2Publication Date: 2014-04-08
- Inventor: Min Hao Hong , You-Hua Chou , Chih-Tsung Lee , Shiu-Ko JangJian , Miao-Cheng Liao , Hsiang Hsiang Ko , Chen-Ming Huang
- Applicant: Min Hao Hong , You-Hua Chou , Chih-Tsung Lee , Shiu-Ko JangJian , Miao-Cheng Liao , Hsiang Hsiang Ko , Chen-Ming Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/085
- IPC: H01L27/085

Abstract:
An integrated circuit device and a process for making the integrated circuit device. The integrated circuit device including a substrate having a trench formed therein, a first layer of isolation material occupying the trench, a second layer of isolation material formed over the first layer of isolation material, an epitaxially-grown silicon layer on the substrate and horizontally adjacent the second layer of isolation material, and a gate structure formed on the epitaxially-grown silicon, the gate structure defining a channel.
Public/Granted literature
- US20140054653A1 TWO-STEP SHALLOW TRENCH ISOLATION (STI) PROCESS Public/Granted day:2014-02-27
Information query
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