Invention Grant
- Patent Title: Lateral trench MESFET
- Patent Title (中): 横向沟槽MESFET
-
Application No.: US13152477Application Date: 2011-06-03
-
Publication No.: US08692319B2Publication Date: 2014-04-08
- Inventor: Franz Hirler , Andreas Peter Meiser
- Applicant: Franz Hirler , Andreas Peter Meiser
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A transistor includes a trench formed in a semiconductor body, the trench having sidewalls and a bottom. The transistor further includes a first semiconductor material disposed in the trench adjacent the sidewalls and a second semiconductor material disposed in the trench and spaced apart from the sidewalls by the first semiconductor material. The second semiconductor material has a different band gap than the first semiconductor material. The transistor also includes a gate material disposed in the trench and spaced apart from the first semiconductor material by the second semiconductor material. The gate material provides a gate of the transistor. Source and drain regions are arranged in the trench with a channel interposed between the source and drain regions in the first or second semiconductor material so that the channel has a lateral current flow direction along the sidewalls of the trench.
Public/Granted literature
- US20120305987A1 LATERAL TRENCH MESFET Public/Granted day:2012-12-06
Information query
IPC分类: