Invention Grant
- Patent Title: Micromechanical component having a rear volume
- Patent Title (中): 具有后体积的微机械部件
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Application No.: US12737521Application Date: 2009-06-03
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Publication No.: US08692339B2Publication Date: 2014-04-08
- Inventor: Jochen Reinmuth , Michael Saettler , Stefan Weiss , Arnim Hoechst
- Applicant: Jochen Reinmuth , Michael Saettler , Stefan Weiss , Arnim Hoechst
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102008040597 20080722
- International Application: PCT/EP2009/056774 WO 20090603
- International Announcement: WO2010/009934 WO 20100128
- Main IPC: H04R17/00
- IPC: H04R17/00
Abstract:
In a method for manufacturing a micromechanical component, a cavity is produced in the substrate from an opening at the rear of a monocrystalline semiconductor substrate. The etching process used for this purpose and the monocrystalline semiconductor substrate used are controlled in such a way that a largely rectangular cavity is formed.
Public/Granted literature
- US20110198713A1 MICROMECHANICAL COMPONENT HAVING A REAR VOLUME Public/Granted day:2011-08-18
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