Invention Grant
US08692370B2 Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
有权
带有铜线的半导体器件与电极焊盘焊接，包括缓冲层
- Patent Title: Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
- Patent Title (中): 带有铜线的半导体器件与电极焊盘焊接，包括缓冲层
-
Application No.: US13203439Application Date: 2010-02-25
-
Publication No.: US08692370B2Publication Date: 2014-04-08
- Inventor: Takashi Kitazawa , Yasushige Sakamoto , Motoaki Wakui
- Applicant: Takashi Kitazawa , Yasushige Sakamoto , Motoaki Wakui
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Priority: JP2009-045569 20090227; JP2009-085847 20090331
- International Application: PCT/JP2010/053487 WO 20100225
- International Announcement: WO2010/098500 WO 20100902
- Main IPC: H01L23/49
- IPC: H01L23/49
Abstract:
A semiconductor element (10) is secured to an island (7), and a plurality of through-holes (8) are formed in the portion of the island (7), which surrounds the area to which the semiconductor element (10) is secured. Further, the electrode pads of the semiconductor element (10) and leads (4) are electrically connected by copper wires (11). In this structure, the cost of materials is reduced by using the copper wires (11) in comparison with gold wires. Further, a part of a resin package (2) is embedded in through-holes (8), so that the island (7) can be easily supported within the resin package (2).
Public/Granted literature
- US20110304046A1 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME Public/Granted day:2011-12-15
Information query
IPC分类:
