Invention Grant
US08692377B2 Integrated circuit packaging system with plated leads and method of manufacture thereof
有权
具有电镀引线的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit packaging system with plated leads and method of manufacture thereof
- Patent Title (中): 具有电镀引线的集成电路封装系统及其制造方法
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Application No.: US13069744Application Date: 2011-03-23
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Publication No.: US08692377B2Publication Date: 2014-04-08
- Inventor: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/498
- IPC: H01L23/498
Abstract:
An integrated circuit packaging system and method of manufacture thereof includes: an L-plated lead; a die conductively connected to the L-plated lead; and an encapsulant encapsulating the L-plated lead and the die.
Public/Granted literature
- US20120241966A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED LEADS AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2012-09-27
Information query
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