Invention Grant
- Patent Title: Embedded ball grid array substrate and manufacturing method thereof
- Patent Title (中): 嵌入式球栅阵列基板及其制造方法
-
Application No.: US12972310Application Date: 2010-12-17
-
Publication No.: US08692391B2Publication Date: 2014-04-08
- Inventor: Tae Sung Jeong , Doo Hwan Lee , Seung Eun Lee
- Applicant: Tae Sung Jeong , Doo Hwan Lee , Seung Eun Lee
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Blakely, Sokoloff, Taylor & Zafman, LLP
- Priority: KR10-2010-0089021 20100910
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H05K1/18
Abstract:
Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad.
Public/Granted literature
- US20120061833A1 EMBEDDED BALL GRID ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-03-15
Information query
IPC分类:
