The various embodiments include methods and apparatus relating to manufacturing a PCB assembly. The layers in a stacked arrangement forming the PCB assembly include at least one RF ground layer that extends in a unitary manner beyond the plurality of stacked layers to form an antenna ground plane that spans the portion of the layer within the PCB assembly and the portion of the layer extending beyond the PCB assembly. The extended conductive layer forms a continuous ground plane element along a width of the PCB assembly. The antenna ground plane extension extending beyond the PCB assembly may be flexible, enabling it to be fit within or extend beyond the casing of a small device, such as a watch telephone.