Invention Grant
US08693164B2 Electrical multi-layered component and circuit arrangement comprising the same 有权
电气多层构件和包括其的电路装置

  • Patent Title: Electrical multi-layered component and circuit arrangement comprising the same
  • Patent Title (中): 电气多层构件和包括其的电路装置
  • Application No.: US13139166
    Application Date: 2009-12-10
  • Publication No.: US08693164B2
    Publication Date: 2014-04-08
  • Inventor: Thomas FeichtingerGeorg Krenn
  • Applicant: Thomas FeichtingerGeorg Krenn
  • Applicant Address: DE Munich
  • Assignee: Epcos AG
  • Current Assignee: Epcos AG
  • Current Assignee Address: DE Munich
  • Agency: Slater & Matsil, L.L.P.
  • Priority: DE102008062023 20081212
  • International Application: PCT/EP2009/066855 WO 20091210
  • International Announcement: WO2010/066848 WO 20100617
  • Main IPC: H01G4/30
  • IPC: H01G4/30
Electrical multi-layered component and circuit arrangement comprising the same
Abstract:
An electrical multi-layered component includes a monolithic base member that has a plurality of ceramic layers and electrode layers disposed one on top of the other in alternating fashion. The base member includes two end surfaces opposite to one another and two side surfaces opposite to one another. The multi-layered component includes a plurality of external electrodes and a plurality of internal electrodes designed into the electrode layers. The internal electrodes at least partially overlap and form overlap areas. Each internal electrode is associated with a respective external electrode. At least one first internal electrode extending from an end surface overlaps with at least one second internal electrode (8) extending from an opposite end surface. At least a third internal electrode extends from an end surface. The third internal electrode overlapping with the first and the second internal electrode
Information query
Patent Agency Ranking
0/0