Invention Grant
- Patent Title: Electronic component and lead-wire for the same
- Patent Title (中): 电子元器件和导线相同
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Application No.: US13387151Application Date: 2011-08-23
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Publication No.: US08693167B2Publication Date: 2014-04-08
- Inventor: Yasuhiro Yano , Douyuu Hachisu , Junji Yamane
- Applicant: Yasuhiro Yano , Douyuu Hachisu , Junji Yamane
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Panasonic Patent Center
- Priority: JP2010-202590 20100910
- International Application: PCT/JP2011/004660 WO 20110823
- International Announcement: WO2012/032720 WO 20120315
- Main IPC: H01G9/10
- IPC: H01G9/10

Abstract:
An electronic component includes a lead wire, a functional element, and an outer housing. The lead wire includes a leader electrode made of metal containing aluminum, a metal wire containing tin, and a welded section formed by welding a first end of the metal wire to a first end of the leader electrode. A second end of the leader electrode is connected to the functional element. The outer housing seals the functional element therein such that a second end of the metal wire is led out therefrom. The lead wire further includes a resin film coating the welded section at least at a portion not covered with the outer housing. Resin material for the resin film has pierce strength of 0.05 MPa/μm per unit thickness or greater and an elastic coefficient of 10 GPa or less.
Public/Granted literature
- US20120267161A1 ELECTRONIC COMPONENT AND LEAD-WIRE FOR THE SAME Public/Granted day:2012-10-25
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