Invention Grant
- Patent Title: Heat transferring module and start up method of electronic device
- Patent Title (中): 传热模块及电子装置启动方式
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Application No.: US13342337Application Date: 2012-01-03
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Publication No.: US08693186B2Publication Date: 2014-04-08
- Inventor: Chi-Jung Wu
- Applicant: Chi-Jung Wu
- Applicant Address: TW Hsinchu
- Assignee: Getac Technology Corporation
- Current Assignee: Getac Technology Corporation
- Current Assignee Address: TW Hsinchu
- Priority: CN201110243210 20110824
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00

Abstract:
A heat transferring module adapted to an electronic device is provided. The electronic device includes at least one heat source and a plurality of ready-to-heat elements. The heat transferring module includes at least one water head, at least two loop heat pipes, at least two pumps, and a working fluid. The water head is thermally connected to the heat source. The loop heat pipes are connected to the water head respectively, and at least one of the loop heat pipes is thermally connected to the ready-to-heat elements. Each pump is connected to the corresponding loop heat pipe. The working fluid flows into the water head and at least one of the loop heat pipes by at least one of the pumps, so heat generated by the heat source is transferred to at least one of the ready-to-heat elements. A method of starting up an electronic device is also provided.
Public/Granted literature
- US20130050936A1 HEAT TRANSFERRING MODULE AND START UP METHOD OF ELECTRONIC DEVICE Public/Granted day:2013-02-28
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