An electronic apparatus includes a body frame, a rear frame which is pivotably attached to the body frame, a hole which is formed in a front wall of the body frame, a first heat dissipating member which is placed on the front wall to cover the hole, a thermal conductive member which contacts a portion of the first heat dissipating member at a storage space side and is placed in the hole, a semiconductor chip which is placed on the rear frame, and a second heat dissipating member which is placed on the rear frame to be in contact with the semiconductor chip and receive heat from the semiconductor chip. The second heat dissipating member being in contact with the thermal conductive member in the storage space when the rear frame closes an opening at the rear side of the body frame.