Invention Grant
- Patent Title: Chassis apparatus protruding electronic devices
- Patent Title (中): 底盘设备突出电子设备
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Application No.: US13460991Application Date: 2012-05-01
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Publication No.: US08693195B2Publication Date: 2014-04-08
- Inventor: David G. Rohrer , Glenn C. Simon
- Applicant: David G. Rohrer , Glenn C. Simon
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An apparatus includes a chassis that further includes at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion of a first electronic device outside the enclosure by preventing further insertion of the first electronic device into the enclosure.
Public/Granted literature
- US20130293075A1 CHASSIS APPARATUS PROTRUDING ELECTRONIC DEVICES Public/Granted day:2013-11-07
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