Invention Grant
- Patent Title: Semiconductor device including plural chips stacked to each other
- Patent Title (中): 包括彼此堆叠的多个芯片的半导体装置
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Application No.: US13436592Application Date: 2012-03-30
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Publication No.: US08693230B2Publication Date: 2014-04-08
- Inventor: Chikara Kondo
- Applicant: Chikara Kondo
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2011-080393 20110331
- Main IPC: G11C7/02
- IPC: G11C7/02 ; G11C5/06 ; G11C8/18 ; G06F13/00

Abstract:
Disclosed herein is a device that includes a plurality of stacked core chips and an interface chip that controls the core chips. Each of the core chips includes a memory cell array, a penetration electrode, and an output circuit that outputs read data that are read from the memory cell array to the penetration electrode. The penetration electrode respectively provided in the core chips are commonly connected with each other, and the output circuits respectively provided in the core chips are activated in response to a read clock signal supplied from the interface chip.
Public/Granted literature
- US20120250387A1 SEMICONDUCTOR DEVICE INCLUDING PLURAL CHIPS STACKED TO EACH OTHER Public/Granted day:2012-10-04
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