Invention Grant
US08693230B2 Semiconductor device including plural chips stacked to each other 有权
包括彼此堆叠的多个芯片的半导体装置

Semiconductor device including plural chips stacked to each other
Abstract:
Disclosed herein is a device that includes a plurality of stacked core chips and an interface chip that controls the core chips. Each of the core chips includes a memory cell array, a penetration electrode, and an output circuit that outputs read data that are read from the memory cell array to the penetration electrode. The penetration electrode respectively provided in the core chips are commonly connected with each other, and the output circuits respectively provided in the core chips are activated in response to a read clock signal supplied from the interface chip.
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