Invention Grant
- Patent Title: Couplings within memory devices
- Patent Title (中): 存储器件内的联轴器
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Application No.: US13495287Application Date: 2012-06-13
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Publication No.: US08693231B2Publication Date: 2014-04-08
- Inventor: Akira Goda , Seiichi Aritome
- Applicant: Akira Goda , Seiichi Aritome
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Leffert Jay & Polglaze, P.A.
- Main IPC: G11C5/06
- IPC: G11C5/06

Abstract:
A memory device includes a first bit line coupled to a first source/drain region of a first multiplexer gate, a second bit line coupled to a first source/drain region of a second multiplexer gate, and a sensing device having an input coupled to a second source/drain region of the first multiplexer gate and a second source/drain region of the second multiplexer gate. The input of the sensing device is formed at a vertical level that is different than a vertical level at which at least one of the first and second bit lines is formed.
Public/Granted literature
- US20120258574A1 COUPLINGS WITHIN MEMORY DEVICES Public/Granted day:2012-10-11
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