Invention Grant
- Patent Title: Semiconductor device including plural chips stacked to each other
- Patent Title (中): 包括彼此堆叠的多个芯片的半导体装置
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Application No.: US13347542Application Date: 2012-01-10
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Publication No.: US08693277B2Publication Date: 2014-04-08
- Inventor: Junichi Hayashi
- Applicant: Junichi Hayashi
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2011-005903 20110114
- Main IPC: G11C8/00
- IPC: G11C8/00

Abstract:
Such a device is disclosed that includes a first chip outputting a bank address signal and an active signal, and a plurality of second chips stacked on the first chip. Each of the second chips includes a plurality of memory banks each selected based on the bank address signal. Selected one or ones of the memory banks is brought into an active state in response to the active signal. Each of the second chips activates a local bank active signal when at least one of the memory banks included therein is in the active state. The first chip activates a bank active signal when at least one of the local bank active signals is activated.
Public/Granted literature
- US20120182822A1 SEMICONDUCTOR DEVICE INCLUDING PLURAL CHIPS STACKED TO EACH OTHER Public/Granted day:2012-07-19
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