Invention Grant
- Patent Title: Data center thermal monitoring
- Patent Title (中): 数据中心热监测
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Application No.: US12981671Application Date: 2010-12-30
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Publication No.: US08694279B1Publication Date: 2014-04-08
- Inventor: David W. Stiver , Gregory P. Imwalle
- Applicant: David W. Stiver , Gregory P. Imwalle
- Applicant Address: US CA Mountain View
- Assignee: Exaflop LLC
- Current Assignee: Exaflop LLC
- Current Assignee Address: US CA Mountain View
- Agency: Fish & Richardson P.C.
- Main IPC: G01R21/00
- IPC: G01R21/00

Abstract:
A system includes a first computing component and a second computing component. A first measurement indicative of a temperature of a first computing component is received. A second measurement indicative of a temperature of a second computing component is received. A thermal value is calculated for the first computing component based on the first measurement and the second measurement. In response to determining that the calculated thermal value exceeds the threshold, an operational or physical parameter of the system is modified.
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