Invention Grant
- Patent Title: Core wrapping in the presence of an embedded wrapped core
- Patent Title (中): 核心包装在一个嵌入式包装的核心存在
-
Application No.: US13633334Application Date: 2012-10-02
-
Publication No.: US08694951B1Publication Date: 2014-04-08
- Inventor: Narendra B. Devta Prasanna , Saket K. Goyal , Vankat Rajesh Atluri
- Applicant: LSI Corporation
- Applicant Address: US CA San Jose
- Assignee: LSI Corporation
- Current Assignee: LSI Corporation
- Current Assignee Address: US CA San Jose
- Agency: Christopher P. Maiorana, PC
- Main IPC: G06F11/22
- IPC: G06F11/22 ; G06F17/50

Abstract:
An apparatus having a core and one or more logic blocks is disclosed. The core may be embedded within the apparatus. The core is generally (i) configured to perform a function and (ii) wrapped internally by a first scan chain before being embedded within the apparatus. The logic blocks may be (i) positioned external to the core and (ii) coupled to one or more parallel interfaces of the first scan chain. A second scan chain may be configured to wrap both the logic blocks and the core.
Public/Granted literature
- US20140096097A1 CORE WRAPPING IN THE PRESENCE OF AN EMBEDDED WRAPPED CORE Public/Granted day:2014-04-03
Information query