Invention Grant
- Patent Title: Hole producing system
- Patent Title (中): 产孔系统
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Application No.: US13440489Application Date: 2012-04-05
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Publication No.: US08695217B2Publication Date: 2014-04-15
- Inventor: Nagaraja Rudrapatna , Bhawan Patel
- Applicant: Nagaraja Rudrapatna , Bhawan Patel
- Applicant Address: CA Longueuil
- Assignee: Pratt & Whitney Canada Corp.
- Current Assignee: Pratt & Whitney Canada Corp.
- Current Assignee Address: CA Longueuil
- Agency: Norton Rose Fulbright Canada LLP
- Main IPC: B23P17/00
- IPC: B23P17/00

Abstract:
A system for producing a plurality of spaced holes in a component which includes a hole producing machine, a control system in communication with the hole producing machine, and a hole pattern definition module which provides instructions to the control system for operating and controlling the hole producing machine. The hole pattern definition module determines a desired distribution of the holes in the component using predetermined input parameters.
Public/Granted literature
- US20120187095A1 HOLE PRODUCING SYSTEM Public/Granted day:2012-07-26
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