Invention Grant
- Patent Title: Modular building structure
- Patent Title (中): 模块化建筑结构
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Application No.: US11886572Application Date: 2006-03-20
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Publication No.: US08695310B2Publication Date: 2014-04-15
- Inventor: Jean-Robert Tremblay
- Applicant: Jean-Robert Tremblay
- Applicant Address: CA Mont-Royal, Quebec
- Assignee: 3088-7418 Quebec Inc.
- Current Assignee: 3088-7418 Quebec Inc.
- Current Assignee Address: CA Mont-Royal, Quebec
- Agency: Benoit & Côté Inc.
- International Application: PCT/CA2006/000427 WO 20060320
- International Announcement: WO2006/096997 WO 20060921
- Main IPC: E04B1/61
- IPC: E04B1/61 ; E04C2/34

Abstract:
The disclosure relates to a kit for building an exterior wall of a modular building structure. The kit comprises at least two substantially elongated posts and a wall panel for installing on the at least two posts. The wall panel includes a wall panel first attachment and a wall panel second attachment. The wall panel first and second attachments each includes an L-shaped wall panel attachment linking member, an attachment bracket post attachment portion, a wall panel attachment bracket and an attachment bracket spacing section.
Public/Granted literature
- US20090013639A1 Modular Building Structure Public/Granted day:2009-01-15
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